|
Laszlo C. Geczy
|
| Title: |
Product Manager |
| Industry: |
Semiconductor |
| Type of Organization: |
Manufacturing |
| Major Product/Service: |
Ball placement systems for placing solder balls onto wafers, strips or singulated Ball Grid Array (BGA) and chip scale packages |
| Expertise: |
Mr. Geczy has over 40 years technical engineering experience and eight years with the current company. He serves as a Senior Product Engineer and is responsible for consulting, process development and semi-conductor design. Mr. Geczy teaches automation technology at Gateway Community College. |
| Geographic Area of Distribution: |
International |
| Affiliations: |
S.M.E. |
| University/Degree: |
Six Sigma Black Belt, Villanova University, |
| Born: |
Budapest, Hungary |
| Hobbies/Sports: |
Education, teaching, trade journals |
| Published Works: |
Articles, Semiconductor Trade Journals |
